C7.2 - Dual-Sensor Package Technology Supporting ASIL-D in Safety-Related Automotive Applications
- Event
- AMA Conferences 2015
2015-05-19 - 2015-05-21
Nürnberg, Germany - Band
- Proceedings SENSOR 2015
- Chapter
- C7 - Automotive Sensors
- Author(s)
- W. Scheibenzuber - Infineon Technologies AG, Neubiberg (Germany), F. Moissl - Infineon Technologies AG, Regensburg (Germany), J. Nimler Elemparo - Infineon Technologies Malaysia Sdn. Bhd., Kulim (Malaysia), O. Borghetti - Infineon Technologies Austria AG, Villach (Austria)
- Pages
- 469 - 471
- DOI
- 10.5162/sensor2015/C7.2
- ISBN
- 978-3-9813484-8-4
- Price
- free
Abstract
We present a dual-sensor package technology allowing integration of two separate sensor chips in just one device, which has the same dimensions as a regular single-chip sensor. By offering built-in redundancy, the dual-sensor package supports the achievement of the highest safety level, ASIL-D in safety-related automotive applications.
The chips are placed on top and bottom of the package leadframe, so that the lateral position of the sensing elements coincides. This mounting technique ensures a maximum relative measurement accuracy of the two sensor chips. Furthermore, the small footprint of the dual-sensor package enables the implementation of redundant sensors in applications with limited space, thus saving precious space and cost.