2025 SMSI Bannerklein

Available documents

Event Title Author(s)
AMA Conferences 2015 A3.2 - Applications of a Compact Ultrasonic 3D Sensor for Recognition of Shape and Orientation of Objects C. Walter, H. Schweinzer - Vienna University of Technology, Vienna (Austria)
AMA Conferences 2015 A3.3 - Waveguide characteristics of elastic pipes filled with multiphase fluids Dipl.-Ing. S. Wöckel, Dipl.-Ing. H. Arndt, Dr.-Ing. U. Steinmann, Prof. Dr. J. Auge - Institut für Automation und Kommunikation (ifak) e.V. Magdeburg (Germany)
AMA Conferences 2015 A3.4 - Annular Arrays for Novel Measurement Methods E. Kühnicke, M. Wolf, S. Kümmritz, M. Lenz - Dresden University of Technology, Dresden (Germany)
AMA Conferences 2015 A4.1 - Spray-on Ferroelectrics for Fabrication of Custom Tailored Composite Transducers for NDE and SHM K. Sinding, A. Orr, B. Tien, N. Malarich, B. Tittmann - Pennsylvania State University, Pennsylvania (USA)
AMA Conferences 2015 A4.2 - Measurement of Frequency Dependent Radiation Patterns of Ultrasonic (Wedge) Transducers P. Ploß, S. Rupitsch, R. Lerch - University of Erlangen-Nuremberg, Erlangen (Germany)
AMA Conferences 2015 A4.3 - Modular Phased Array Ultrasound Doppler Platform for Measurements in Liquid Metals H. Beyer, R. Nauber, N. Thieme, L. Büttner, J. Czarske - Technische Universität Dresden (Germany)
AMA Conferences 2015 A5.1 - Simulation assisted ultrasonic defect characterization in heavy rotor forgings K. Fendt, H. Mooshofer - Siemens AG, Munich (Germany), S. Rupitsch, H. Ermert - Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen (Germany)
AMA Conferences 2015 A5.2 - Ultrasound Transmission System for TDOA Localization with Unsynchronized Beacons A. Ens, L. Reindl, J. Bordoy, J. Wendeberg, C. Schindelhauer - University of Freiburg (Germany)
AMA Conferences 2015 A5.3 - Laser-Acoustic Characterization of Coatings F. Singer - Institute of Sensor and Actuator Technology, Coburg (Germany)
AMA Conferences 2015 A5.4 - Unidirectional Acoustic Sensor Based on the Particle Velocity Gradient S. Yu, Y. Yang - Northwestern Polytechnical University, Xi’an (China), G. Carrillo Pousa, D. Fernández Comesaña - Microflown Technologies, Arnhem (The Netherlands)