D2.2 - Smart Sensor Systems - Packaging Technologien for Multi-Sensory Consumer Applications
- Event
- SENSOR+TEST Conferences 2009
2009-05-26 - 2009-05-28
Congress Center Nürnberg - Band
- Proceedings SENSOR 2009, Volume I
- Chapter
- D2 - Sensors for Smart Systems
- Author(s)
- E. Jung, K. Becker, T. Braun, R. Aschenbrenner - Fraunhofer IZM, Berlin, Germany
- Pages
- 323 - 325
- DOI
- 10.5162/sensor09/v1/d2.2
- ISBN
- 978-3-9810993-4-8
- Price
- free
Abstract
Advanced silicon technologies offer the possibility of integrating hundreds of millions of transistors in a single electronic component such as a microprocessor. Experts predict that the increase of components per chip will follow the well known "Moore's law" in the next decade, too. "Microelectronics" will become "Nanoelectronics". This trend can be characterized by "More Moore". If electronic signal and data processing systems are focused, nanoelectronic components will be very cost efficient due to larger wafer sizes and a high degree of miniaturization (System-on-Chip). But future multifunctional systems require not only more signal and data processing power but also require interfaces to the human sensory organs and altogether functions for an interaction with the environment. Besides these, antennas, components for optical signals and data transmission as well as functions for energy conversion and storage are also needed.