B1.2 - FTI Thermal Modelling using Rough Order Model
- Event
- ETTC 2024 - European Test and Telemetry Conference
2024-06-11 - 2024-06-13
Nuremberg - Chapter
- Data Acquisition I
- Author(s)
- D. Doyle - Curtiss-Wright, Dublin (Ireland)
- Pages
- 160 - 165
- DOI
- 10.5162/ETTC2024/B1.2
- ISBN
- 978-3-910600-02-7
- Price
- free
Abstract
There is an industry drive in Flight Test Instrumentation to make the acquisition units smaller and more powerful; smaller with less weight to fit in tighter, more disturbed locations; and more powerful to facilitate fast, powerful, high-speed chips and to provide excitation to sensors. This drive to minimization and high-power means that thought needs to be given to thermodynamics and the management of heat dissipation. This in turn means that tools and Techniques to predict thermal performance are becoming more and more important. This paper is a study of a thermal modelling technique using a rough order model and open source pSpice to run the thermal system as an analogous electronic circuit. With this tool we can predict the thermal performance the installation with a view to having a successful fight test campaign.