Available documents

Event Title Author(s)
AMA Conferences 2013 P2.2 - Test Field for the Validation of a Multifunctional Sensor for Distributed Subsurface Monitoring of Gas Storage Areas P. Neumann, A. Wosniok, M. Bartholmai - BAM Federal Institute for Materials Research and Testing, Berlin (Germany), D. Lazik - Membranbasierte Gassensoren UG – MeGaSen, Potsdam (Germany)
AMA Conferences 2013 P2.3 - A planar solid-state potentiometric CO2 sensor in thick-film technology for breath analysis S. Wiegärtner, G. Hagen, J. Kita - University of Bayreuth (Germany), E. Glaser, J. Spallek - Corscience GmbH & Co. KG, Erlangen (Germany), C. Schmaus - Siegert electronic GmbH, Cadolzburg (Germany)
AMA Conferences 2013 P2.4 - Fabrication of Copper Nanowires from Aqueous Solution C. Schmädicke, A. Nerowski, L. Baraban, L. Renner - Dresden University of Technology (Germany), G. Cuniberti - Division of IT Convergence Engineering, Pohang (Korea)
AMA Conferences 2013 P2.5 - High sensitivity optoelectronic sensor for nitric oxide detection in exhaled air J. Wojtas, Z. Bielecki, J. Mikolajczyk - Military Univ. of Technology, Warsaw (Poland), T. Stacewicz - University of Warsaw (Poland)
AMA Conferences 2013 P2.6 - Evaluation of Heater Temperature to Detect Gases in a Flowing Fluid C. Hepp, F. Krogmann - Innovative Sensor Technology IST AG, Ebnat-Kappel (Switzerland), G. Urban - University of Freiburg (Germany)
AMA Conferences 2013 P2.7 - Pulsed Polarization of Lambda Probes – Evaluation of the Polarization Current S. Fischer, R. Moos - University of Bayreuth (Germany), R. Pohle, E. Magori, M. Fleischer - Siemens AG, Munich (Germany), B. Farber - BJR Sensors, LLC, Solon (USA)
AMA Conferences 2013 P3.1 - Development and Characterization of a High Precision Vibratory MEMS Gyroscope System with Low-Noise Integrated Readout and Control Electronics D. Köhler, S. Konietzka, A. Pohle, S. Heinz, A. Lange - EDC Electronic Design Chemnitz GmbH (Germany), R. Forke, D. Billep - Fraunhofer ENAS Chemnitz (Germany), K. Hiller - Chemnitz University of Technology (Germany)
AMA Conferences 2013 P3.2 - Low-cost Thick-film Sensor Based on Piezoelectric Effect for Ballistic Application D. Crescini - Università di Brescia (Italy)
AMA Conferences 2013 P3.3 - Innovation and robust sensor product development with Design for Six Sigma W. Korb - arteos GmbH, Seligenstadt (Germany), H. Kremer - micro-part GmbH+Co.is.KG, Oestrich-Winkel (Germany)
AMA Conferences 2013 P3.4 - Fabrication of Silicon Oxycarbide-Based Microcomponents via Photolithographic and Soft Lithography Approaches E. Ionescu, S. Martinez Crespiera, M. Schlosser, R. Riedel, K. Flittner, H. Schlaak - Technische Universität Darmstadt (Germany)