2.2 - New Developments for Thermopile Array Sensors in Packages as small as TO39
- Event
- AMA Conferences 2013
2013-05-14 - 2013-05-16
Nürnberg - Band
- Proceedings IRS² 2013
- Chapter
- I2 - Recent Developments in IR Industry
- Author(s)
- M. Schnorr, B. Forg, F. Herrmann, W. Leneke, J. Schieferdecker, M. Schulze, M. Simon, K. Storck - Heimann Sensor GmbH, Dresden (Germany), L. Buydens - Melexis Technologies, Tessenderlo (Belgien)
- Pages
- 28 - 31
- DOI
- 10.5162/irs2013/i2.2
- ISBN
- 978-3-9813484-3-9
- Price
- free
Abstract
Heimann Sensor further improved the sensitivity, the image quality and the distance dependency of the HTPA8x8. In addition Heimann Sensor announced the new HTPA16x4 with a fully digital I²C connection, both fitting inside a TO39 housing.