| AMA Conferences 2013 |
2.1 - Low power consumption infrared thermal sensor array for smart detection and thermal imaging applications |
P. Robert, F. Trolez, E. Bercier, H. Clerambault, A. Touvignon, J. Tissot - ULIS, Veurey-Voroize (France) |
| AMA Conferences 2013 |
2.2 - New Developments for Thermopile Array Sensors in Packages as small as TO39 |
M. Schnorr, B. Forg, F. Herrmann, W. Leneke, J. Schieferdecker, M. Schulze, M. Simon, K. Storck - Heimann Sensor GmbH, Dresden (Germany), L. Buydens - Melexis Technologies, Tessenderlo (Belgien) |
| AMA Conferences 2013 |
2.3 - Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process |
M. Krueger - Robert Bosch GmbH, Reutlingen (Germany), I. Herrmann - Robert Bosch GmbH, Gerlingen (Germany) |
| AMA Conferences 2013 |
2.4 - Electro-Optical Properties of InAs/GaSb Superlattice Infrared Photodiodes for Bispectral Detection |
A. Wörl, F. Rutz, R. Rehm, J. Masur, P. Kleinow, J. Schmitz, J. Niemasz, W. Luppold, T. Stadelmann, M. Walther - Fraunhofer-Institut für Angewandte Festkörperphysik, Freiburg (Germany), T. Simon, R. Scheibner, J. Ziegler - AIM Infrarot-Module GmbH, Heilbronn (Germany) |
| AMA Conferences 2013 |
2.5 - New Thermal Imager for Long Range Surveillance |
J. Fritze, H. Schlemmer - Cassidian Optronics GmbH, Oberkochen (Germany) |
