B3.3 - Properties of a novel silver sintering die attach material for high temperature - high lifetime applications
- Event
- AMA Conferences 2013
2013-05-14 - 2013-05-16
Nürnberg - Band
- Proceedings SENSOR 2013
- Chapter
- B3 - Packaging
- Author(s)
- S. Kraft, S. Zischler, N. Tham, A. Schletz - Fraunhofer Institute for Integrated Systems and Device Technology IISB, Nuremberg (Germany)
- Pages
- 242 - 247
- DOI
- 10.5162/sensor2013/B3.3
- ISBN
- 978-3-9813484-3-9
- Price
- free
Abstract
Silver sintering technology has proven to be a high reliable alternative for solder die attaches as well as wire bonding. Previous work at Fraunhofer IISB showed as well a rise in passive temperature cycling capability as in active temperature cycling lifetime with power electronic test modules compared to soldered and wire bonded samples. Since it is a new die attach technology, the material’s properties are still not yet well know. In this work, the Young’s modulus will be investigated for two different silver sinter pastes depending on mounting parameters and proceeding material fatigue during passive temperature cycling.