| AMA Conferences 2013 |
B3.1 - Assembly and Interconnection Technologies for Sensors for Very High Temperature Applications |
J. Wilde, P. Wagner, R. Zeiser - University of Freiburg (Germany) |
| AMA Conferences 2013 |
B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers |
F. Roscher, A. Otto, R. Döring, S. Rzepka, M. Wiemer - Fraunhofer Institute for Electronic Nano Systems, Chemnitz (Germany), M. Ihle, S. Ziesche - Fraunhofer Institute for Ceramic Technologies and Systems, Dresden (Germany) |
| AMA Conferences 2013 |
B3.3 - Properties of a novel silver sintering die attach material for high temperature - high lifetime applications |
S. Kraft, S. Zischler, N. Tham, A. Schletz - Fraunhofer Institute for Integrated Systems and Device Technology IISB, Nuremberg (Germany) |
| AMA Conferences 2013 |
B3.4 - Hot Stamped Conductors on Nano-Micro Wires Made by Electroplating for Medical Sensors and Micro-Implants |
T. Rossner, R. Sarwar, A. Lyashenko, E. Dörsam, R. Werthschützky - Technische Universität Darmstadt (Germany) |
