P22 - Investigation of Application-Specific Assembly Technologies and Metrological Influencing Factors of MEMS-based NIR Spectral Sensors
- Event
- 22. GMA/ITG-Fachtagung Sensoren und Messsysteme 2024
2024-06-11 - 2024-06-12
Nürnberg - Band
- Poster
- Chapter
- Poster
- Author(s)
- J. Otto, K. Krieger - Universität Bremen (ITEM),Bremen
- Pages
- 505 - 509
- DOI
- 10.5162/sensoren2024/P22
- ISBN
- 978-3-910600-01-0
- Price
- free
Abstract
The article compares different construction and housing technologies of a compact, MEMS-based near-infrared (NIR) spectral sensor and highlights their advantages and disadvantages. The arrangement and alignment of the radiation source and the detector in particular have a significant influence on the quality of the spectral measurement. The optical beam path can be positively influenced by the design of these sensor components, thus improving the spectral measurements. In addition, external mechanical and thermal influencing factors on MEMS spectral detectors are examined and possibilities for algorithmic calibration and compensation are presented. Mechanical vibrations and shocks influence the interferometer in the MEMS-FPI detector, which results in a disturbance of the measurement. Thermal loads, such as temperature fluctuations, also lead to a change in the measurement behavior. This results in a measurement deviation of the detected intensity and wavelength. The concepts and results presented serve as a basis for taking the development of new types of MEMS-based spectral sensors to a new level and promoting their applicability in various areas.