B6.1 - HIL & HTB - challenges and solutions
- Event
- ETTC 2024 - European Test and Telemetry Conference
2024-06-11 - 2024-06-13
Nuremberg - Chapter
- HIL & HTB - challenges and solutions
- Author(s)
- J. Collrep, B. Judd, E. Goethert - United Electronic Industries., Norwood (USA)
- Pages
- 246 - 247
- DOI
- 10.5162/ETTC2024/B6.1
- ISBN
- 978-3-910600-02-7
- Price
- free
Abstract
Hardware in the Loop (HIL) and Hybrid Test Benches (HTB) plays a key role in avionic testing and more data streams are introduced and need to be managed or simulated. There is clear industry need for more simulation to reduce cost and safe time. Nevertheless, the impact of real hardware can’t be neglected and therefore it is essential to consider them also in future bench plannings. Detailed planning and alignment with all stakeholders are essential to achieve major milestones in a new development or program update. It’s about the “what, why, and how” and potential challenges you might face. We will explore them in context of HIL Testing in an avionics environment, highlight how hybrid test benches can provide potential solutions, elaborate on the why it is important to consider various types of sensors and signals before setting up the test and what solutions are available to deal with these challenges. We will talk about specifics on RVDT’s, LVDT’s, strain gauges, Thermocouples and synchros. The paper will describe a typical HIL set-up and will help you to understand the potential challenges, give an idea how to manage and provide solutions for implementation and connectivity of modern & smart HIL testing.