B4.3 - INKtelligent Printing® of Scale Comprehensive Electrical Connections for Thermal Flow Sensors
- Event
- SENSOR+TEST Conferences 2009
2009-05-26 - 2009-05-28
Congress Center Nürnberg - Band
- Proceedings SENSOR 2009, Volume I
- Chapter
- B4 - Sensor Packaging
- Author(s)
- C. Sosna, H. Sturm, R. Buchner, W. Lang - University of Bremen, Bremen, Germany, C. Werner, D. Godlinski, V. Zoellmer, M. Busse - Fraunhofer Institut für Fertigungstechnik und Angewandte Materialforschung, Bremen, Germany
- Pages
- 215 - 219
- DOI
- 10.5162/sensor09/v1/b4.3
- ISBN
- 978-3-9810993-4-8
- Price
- free
Abstract
New printing technologies of functional structures allow new packaging concepts in order to achieve a high grade of miniaturization for integration of micro electro mechanical systems (MEMS). in this case, a thermal flow sensor, designed and fabricated at IMSAS, has been electrically connected to a printed circuit board by means of INKtelligent printings. We used a maskless aerosol deposition technique for deposition of silver lines with a minimum width of 10 ~m. In this way, no bond wires are disturbing the fluid flow within the channel by causing additional turbulences during flow measurement. Due to the possibility to print structures with a resolution down to ten micrometers, the size of bond-pads and therefore the entire sensor size can be reduced.