B4.4 - New Packaging of Flow Sensors with Monolithic Integration of Micro-Channel on Chip
- Event
- SENSOR+TEST Conferences 2009
2009-05-26 - 2009-05-28
Congress Center Nürnberg - Band
- Proceedings SENSOR 2009, Volume I
- Chapter
- B4 - Sensor Packaging
- Author(s)
- S. Billat, K. Kliche, R. Gronmaier, J. Auber, F. Hedirch, M. Ashauer, R. Zengerle - HSG-IMIT Hahn-Schickard Gesellschaft, Villingen-Schwenningen, Germany
- Pages
- 221 - 226
- DOI
- 10.5162/sensor09/v1/b4.4
- ISBN
- 978-3-9810993-4-8
- Price
- free
Abstract
We report on the integration of a micro flow channel with a thermal flow sensor chip. Two different technologies were investigated: First the fluid channel is performed at the back side of the standard HSGIMIT flow sensor chip using standard silicon etching process (KOH and RIE). The second technology consists of a bond process between the flow sensor die and a polydimethylsiloxane (PDMS) sheet containing the channel. Both sensor types can be used for detecting flow rates in the range of 0.1-5.0 μl/min (H2O) and/or pressure differences of 10-600 Pa. Compared to our previous sensor design this leads to reduced packaging costs, increased reproducibility (better than 1 %) and in particular a higher sensitivity at low flow rates. Finally a concept of an adhesive-free packaging of the sensor is presented.