| SENSOR+TEST Conferences 2009 |
C2.1 - Capacitive Sensing |
G. Brasseur - Graz University of Technology, Graz, Austria |
| SENSOR+TEST Conferences 2009 |
C2.2 - High Performance Capacitive Sensor Electronic Interfaces for Displacement Measurement in Industrial Applications |
S. Nihtianov - Technical University Delft, Delft, Netherlands |
| SENSOR+TEST Conferences 2009 |
C2.3 - MEMS Capacitive Sensor Interfaces: Can we Solve the Challenge? |
R. Puers - Katholieke Universiteit Leuven, Leuven, Belgium |
| SENSOR+TEST Conferences 2009 |
C2.4 - High Resolution Capacitive Sensor Systems |
R. Hoenicka - MICRO-EPSILON Messtechnik GmbH & Co. KG, Ortenburg, Germany |
| SENSOR+TEST Conferences 2009 |
C3.1 - A Time-Based Capacitive to Digital Converter With Fast Data Acquisitions and High Resolution |
A. Heidary, G. Meijer - Technical University Delft, Delft, Netherlands |
| SENSOR+TEST Conferences 2009 |
C3.2 - Compact Read-Out Electronics for a Micromachined Thermal Conductivity and Diffusivity Sensor |
B. Mayrhofer, B. Jakoby - Johannes Kepler University, Linz, Austria, J. Kuntner - Vienna University of Technology, Vienna, Austria |
| SENSOR+TEST Conferences 2009 |
C3.3 - Investigation of High-Voltage-CMOS-Technology for the Design of Dynamically Reconfigurable Sensor Electronics |
M. Hetterich, A. Koenig - Technische Universität Kaiserslautern, Kaiserslautern, Germany |
| SENSOR+TEST Conferences 2009 |
C3.4 - Application of Pulsed Digital Oscillators to the in Situ Testing of MEMS Vacuum Packaging |
J. Ricart, J. Pons, M. Dominguez - Technical University of Catalonia, Barcelona, Spain |
| SENSOR+TEST Conferences 2009 |
D2.1 - Sensors for Smart Systems - Requirements to Sensor Systems |
L. Heinze - VDI/VDE Innovation + Technik GmbH, Berlin, Germany |
| SENSOR+TEST Conferences 2009 |
D2.2 - Smart Sensor Systems - Packaging Technologien for Multi-Sensory Consumer Applications |
E. Jung, K. Becker, T. Braun, R. Aschenbrenner - Fraunhofer IZM, Berlin, Germany |
