P2.1.22 The ubiquitous technology for prototype and disposable bio-chemical sensors packaging
- Event
- 14th International Meeting on Chemical Sensors - IMCS 2012
2012-05-20 - 2012-05-23
Nürnberg/Nuremberg, Germany - Chapter
- P2.1 Biosensors
- Author(s)
- D. Ulien, E. Ulieru, A. Tantau - Sitex 45 SRL (Romania), F. Pistritu - Institut of Microtechnology IMT (Romania)
- Pages
- 1393 - 1396
- DOI
- 10.5162/IMCS2012/P2.1.22
- ISBN
- 978-3-9813484-2-2
- Price
- free
Abstract
A new packaging process for silicon-based chemical sensor arrays has been develop using semiconductor, thick film, and flip-chip technologies. Passive sensors are fabricated on silicon in a semiconductor process compatible with the incorporation of on-chip electronics. Sensor-specific polymer membranes are screen-printed directly onto individual electrode sites. Substrates with flow channels are made from glass using semiconductor process technology. Sensor chips are mounted onto the substrate using a flip-chip approach in which the fluid channels are sealed with a polymer gasket. Electrical contacts between the chip and substrate are made through conductive epoxy bumps. Conductors are brought out to the edge of the substrate; where they are accessible to the next level of system interconnect through a standard board-edge connector.