D5.3 - An Advanced Parametric Thermal Model for High Power LED Modules
- Event
- AMA Conferences 2017
2017-05-30 - 2017-06-01
Nürnberg, Germany - Band
- Proceedings Sensor 2017
- Chapter
- D5 - Mechanical Sensors II
- Author(s)
- P. Fulmek, P. Haumer, J. Nicolics - TU-Wien (Austria), F. Wenzl, W. Nemitz - Joanneum Research Forschungsgesellschaft mbH, Weiz (Austria), R. Beigelbeck - Danube University Krems, Wiener Neustadt (Austria)
- Pages
- 504 - 509
- DOI
- 10.5162/sensor2017/D5.3
- ISBN
- 978-3-9816876-4-4
- Price
- free
Abstract
This paper presents a comprehensive static and transient thermal simulation model for high-power LED-modules to produce white light with a defined quality. Since high power and high efficiency InGaN-LEDs emit blue light, a color conversion element (CCE) is necessary to produce the white light. The performance of the CCE is dependent on the temperature and on the blue light flux. While a classical goal of thermal simulation and thermal management is to optimise a thermal resistance for a defined heat source, the goal of our simulations is to control the heat dissipation in the LED-chip and in the CCE, which are dependent on each other and on their temperatures. Both components, LED and CCE, exhibit efficiencies that are nonlinearily dependent on the input power (electrical power, light power) and temperature. Accordingly, the nonlinear properties of both, LED and CCE, need to be integrated into the simulation model. Electrical measurement, optical measurement, temperature measurement, and IR-thermography are used to verify the model-setup. The static and transient simulations use the electrical LED current or voltage as input and determine the temperature distributions in the LED and the CCE, thus allowing for a systematic approach to improve the white light quality and the reliability and lifetime of PC-LED-modules under various operation modes.