2025 SMSI Bannerklein

7.3 - Novel Miniaturized Thermoelectric Hydrogen Pressure Sensor

Event
iCCC2024 - iCampµs Cottbus Conference
2024-05-14 - 2024-05-16
Cottbus
Band
Vorträge
Chapter
Sensorik & Messtechnik
Author(s)
P. Raimann, M. Ahsan, F. Hedrich, S. Billat, A. Dehé - Hahn-Schickard, Villingen-Schwenningen
Pages
100 - 103
DOI
10.5162/iCCC2024/7.3
ISBN
978-3-910600-00-3
Price
free

Abstract

In conventional hydrogen pressure sensors, the stress-sensitive diaphragm is the weakest point in terms of construction. Leading to signal drift of the sensor as hydrogen causes material embrittlement and permeation. We address this issue by using a miniaturized gas pressure sensor without a me-chanical transducer. Our sensor structure consists of a heating element and thermopiles arranged in a thin perforated silicon nitride membrane. In the thermal domain, the structure exhibits a characteristic low-pass behavior whose phase shift is dependent on the hydrogen pressure. A dynamically excited heating element and the evaluation of the thermopile responses are used to measure pressures rang-ing from 100 and 2850 kPa. So far, this is the highest measurement range detected with a thermal pressure sensor that has ever been published in literature. Compared to diaphragm-based MEMS pressure sensors, this chip design offers an intrinsic overload protection as well as low-cost fabrication and simple packaging requirements.

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