| SMSI 2023 |
D5.0 - Compressed Sensing Spectral Photoluminescence Imaging of Wide Bandgap Semiconductor Materials for Power Electronics Applications |
S. Wood, J. Blakesley, G. Koutsourakis, A. Thompson - National Physical Laboratory, Teddington (United Kingdom) |
| SMSI 2023 |
D5.1 - Compressed nano-FTIR Hyperspectral Imaging for Characterizing Defects in Semiconductors |
B. Kästner, C. Elster, A. Hoehl, M. Marschall, D. Siebenkotten, G. Wübbeler - Physikalisch-Technische Bundesanstalt, Berlin (Germany), E. Rühl - Freie Universität Berlin, Berlin (Germany), S. Wood - National Physical Laboratory, Teddington (United Kingdom) |
| SMSI 2023 |
D5.2 - Optical and Tactile Measurements on SiC Sample Defects |
J. Grundmann, B. Bodemann - Physikalisch-Technische Bundesanstalt, Braunschweig (Germany), E. Ermilova, A. Hertwig - Bundesanstalt für Materialforschung und -prüfung, Berlin (Germany), P. Klapetek - Cesky Meteorologicky Institut (CMI), Brno (Czechia), S. Pereira, J. Rafighdoost - Delft University of Technology, Delft (Netherlands) |
| SMSI 2023 |
D5.3 - Electrical Characterization of the SiO2/4H-SiC Interface |
C. Nanjappan, G. Pfusterschmied, U. Schmid - Technische Universität Wien, Vienna (Austria) |
| SMSI 2023 |
D5.4 - Compressed Sensing Time Resolved Photoluminescence Imaging for Semiconductor Characterisation |
A. Baltusis, G. Koutsourakis, S. Wood, S. Sweeney - University of Surrey, Guildford (United Kingdom) |
