P10 - Solder Joint Examination and Characterization by using the 3ω-Method
- Event
- SMSI 2023
2023-05-08 - 2023-05-11
Nürnberg - Band
- Poster
- Chapter
- Poster
- Author(s)
- R. Bernhardsgrütter, Y. Barb, C. Hepp, R. Schädler, J. Schläpfer - Innovative Sensor Technology IST AG, Ebnat-Kappel (Switzerland)
- Pages
- 300 - 301
- DOI
- 10.5162/SMSI2023/P10
- ISBN
- 978-3-9819376-8-8
- Price
- free
Abstract
Solder joint quality strongly depends on the size and number of voids and cracks in it. The check of the quality of these solder joints (e.g. X-ray or photomicrography) is often complex and time-consuming. This paper presents a new approach to examine the solder joint quality of soldered platinum elements by using the . The results show high reliability and are compared to results of photomicrographs and thermal contact measurements using constant temperature anemometry. The presented method enables an automated 100 % validation to increase the solder joint quality.