OT1.159 - Non-Destructive Evaluation of Crack Propagation in Solder Joints of Pressure Sensors Under Thermal Cycling Using Computed Tomography and Finite Element Analysis
- Event
- EUROSENSORS XXXVI
2024-09-01 - 2024-09-04
Debrecen (Hungary) - Band
- Lectures
- Chapter
- OT1 - Theory, Modelling, Design and Testing
- Author(s)
- R. Mógor-Győrffy, E. Szécsi - Robert Bosch Kft, Budapest (Hungary)
- Pages
- 31 - 32
- DOI
- 10.5162/EUROSENSORSXXXVI/OT1.159
- ISBN
- 978-3-910600-03-4
- Price
- free
Abstract
This study investigates crack propagation in pressure sensor solder joints caused by thermal cycling, employing Computed Tomography (CT) for non-destructive monitoring and Finite Element Analysis (FEA) to simulate plastic strain distribution. By periodically examining the solder joints with CT during thermal cycles and measuring crack lengths, we predict the lifetime of the joints. The FEA comple-ments this by predicting damaged regions, with both methods showing good agreement in lifetime estimations.