OT1.216 - Automatic Imaging Based Wafer-Level In-Line Measurement for Piezoelectric MEMS Mirrors
- Event
- EUROSENSORS XXXVI
2024-09-01 - 2024-09-04
Debrecen (Hungary) - Band
- Lectures
- Chapter
- OT1 - Theory, Modelling, Design and Testing
- Author(s)
- P. Raschdorf, S. Winkelmann, J. L., F. Heinrich, L. Wysocki, J. Y. Hwang, S. Gu-Stoppel - Fraunhofer Institute for Silicon Technology, Itzehoe (Germany)
- Pages
- 37 - 38
- DOI
- 10.5162/EUROSENSORSXXXVI/OT1.216
- ISBN
- 978-3-910600-03-4
- Price
- free
Abstract
This work presents the hard- and software development of a customized setup, to determine the total optical scanning angle (TOSA) and respective resonance frequency of resonant MEMS-scanners on wafer level during in-line testing. These electrical measurements are usually used to evaluate piezoe-lectric layer quality and to monitor the manufacturing process. However, the mechanical properties of the complete MEMS-scanners are characterized manually which limits high volume process. The inte-gration of the mechanical measurements into the automated in-line testing leads to a drastic meas-urement time decrease as well as vastly improved resolution on imaging technique base.