OT4.42 - Creep Detection in Composites with Silicon Strain Gauge
- Event
- EUROSENSORS XXXVI
2024-09-01 - 2024-09-04
Debrecen (Hungary) - Band
- Lectures
- Chapter
- OT4 - Physical Sensors and Actuators
- Author(s)
- F. Le Bihan, G. Herry, M. Harnois - Rennes University (IETR), Rennes (France), W. d. A. Caroba Junior - Institution or Centro Federal de Educação Tecnológica de Minas Gerais, Belo Horizonte (Brazil)
- Pages
- 63 - 64
- DOI
- 10.5162/EUROSENSORSXXXVI/OT4.42
- ISBN
- 978-3-910600-03-4
- Price
- free
Abstract
This work shows how the insertion of silicon mechanical sensors into composite structures enables the detection of internal structural variations, and can find applications in process monitoring or structural health monitoring. It includes the description of a novel process for minimally intrusive insertion of sensors inside composites (substrate free transfer printed sensor). Temperature and deformation characterizations reveal a modification of the internal structure of a composite, triggered by a sufficiently high temperature, and linked to the creep phenomenon of the composite's epoxy resin binder.