PT4.234 - Electrochemical Seismometers Using a SOI Chip with Four Micro-electrodes
- Event
- EUROSENSORS XXXVI
2024-09-01 - 2024-09-04
Debrecen (Hungary) - Band
- Poster
- Chapter
- PT4 - Physical Sensors and Actuators
- Author(s)
- D. Chen, Z. Sun, J. Wang, J. Chen - Chinese Academy of Sciences, Beijing (China)
- Pages
- 315 - 316
- DOI
- 10.5162/EUROSENSORSXXXVI/PT4.234
- ISBN
- 978-3-910600-03-4
- Price
- free
Abstract
This paper reports a new method to integrate four micro-electrodes on one SOI wafer with micro-vias of any size. 6 different SOI chips with nice insulation between each electrode was fabricated. After the test of electrochemical seismometers (ECSs), it shows that the ECSs using the chips with large diam-eter and small minimum inter-space of micro-vias feature small bandwidth but large peak sensitivity, which provides a valuable reference for the design of the ECSs meeting different performance.